The analysis discusses technological development, including semiconductor 3D printing innovations. It elaborates on the sector developments and drivers and charts the expected evolution of this technology in the semiconductor sector up to 2028.
• The ecosystem analysis includes breakthroughs for semiconductor 3D printing and the profiles of some key players.
• The commercialization of 3D printing for the semiconductor sector largely centers on printing electronic components, resistors, transistors, capacitors, antennas, radio frequency (RF) devices, etc.
• Many 3D printing companies are pioneering advanced chip packaging technologies as the conventional method is labor-intensive and time-consuming.
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