This research service focuses on key semiconductor types enabling 5G connectivity in devices and network infrastructure. The key components included are Modem ICs/SoC, RFICs, power amplifiers (PA), filters, low noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others. End-user applications include smartphones, network infrastructure (including small cells), fixed wireless access/customer premise equipment (FWA/CPE), and other emerging 5G areas in automotive, industrial, laptops, tablets, mining, medical, and AR/VR.
With various new and emerging 5G use cases, the study highlights the changing customer landscape. Top driving include the rapid increase in the adoption of compound semiconductors, accelerating 5G deployments, growing demand for 5G capable devices, and development in advanced chip fabrication and packaging technologies. The study also highlights key restraints, such as the ongoing geopolitical tensions, supply-chain disruptions, the venturing of end-user industries into chip design and manufacturing, and the need to strike a balance between price, technology, and capacity.
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