• How can original equipment manufacturers use various topologies such as monolithically integrated, microelectromechanical systems (MEMS)-based, and wafer-fused to manufacture VCSELs?
• Why do VCSELs offer higher beam stability and uniformity than competing technologies such as edge-emitting lasers?
• How can participants manufacture VCSELs using standard semiconductor processes?
• What is the adoption potential of this sector across time-of-flight applications, such as in-cabin sensing?
• Why are VCSELs well-staged to capture emerging applications such as gesture recognition and people identification?
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