This analysis service focuses on key semiconductor types enabling 5G connectivity in devices and network infrastructure. The key components included are Modem ICs/SoC, RFICs, power amplifiers (PA), filters, low noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others.
• End-user applications include smartphones, network infrastructure (including small cells), fixed wireless access/customer premise equipment (FWA/CPE), and other emerging 5G areas in automotive, industrial, laptops, tablets, mining, medical, and AR/VR.
• With various new and emerging 5G use cases, the study highlights the changing customer landscape.
• Top driving include the rapid increase in the adoption of compound semiconductors, accelerating 5G deployments, growing demand for 5G capable devices, and development in advanced chip fabrication and packaging technologies.
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