Research Overview

This research study analyzes the adoption of hot melt adhesives (HMA) in various applications across the globe. This global deliverable covers 6 key regions – North America, Europe, India, Rest of Asia (ROA), Middle East (ME) and Rest of the World (ROW) markets; regional analysis is presented at the segment level to illustrate the regional dynamics and opportunities for across applications. This study analyzes the key applications for HMA from many aspects. The levels of penetration of HMA in various applications are also analyzed. Further, the study analyzes the current market size in terms of volumes and revenues based on the average prices of products in the market. It also provides a 7-year forecast based on the expected compound annual growth rate (CAGR) at which the respective application segments are likely to grow. The study bases the forecast on various drivers and restraints along with regional, product, and technology trends. In addition, it also analyzes key market participants and the key competitive factors that are critical for them to gain a strong foothold in the market. To assess the current size of the HMA market and to evaluate its future potential, key growth opportunities and restraining factors are taken into consideration. Price variations and factors impacting the prices of HMA based on the adoption of various chemistries in various applications are also analyzed.

The research service is primarily segmented into packaging, non-wovens, wood-working and furniture, automotive, boon-binding, construction and others (includes medical, electronics, footwear and textiles). Tapes and labels used in packaging, durable tapes such as wire harness tapes, transfer tapes, temporary bonding tapes used in electronics and automotive applications are included in the respective segments. Non-wovens primarily include hygiene products such as baby diapers, training pants, feminine hygiene and adult incontinence products. Each of these applications are further segmented into various chemistries such as ethylene vinyl acetate (EVA), poly-olefins, polyurethane (PUR), polyamides, rubber-based and others (includes silicones and polyesters). Another level of sub-segmentation includes the splits between reactive and non-reactive HMA. Reactive chemistries are largely based on PUR HMA. Pressure-sensitive HMA and non-pressure sensitive HMA is another level of sub-segmentation that is analyzed in the study. Pressure-sensitive adhesives are largely rubber based and are predominantly styrene block co-polymers: styrene isoprene styrene block copolymer (SIS), styrene isoprene-butadiene styrene (SIBS) and styrene-ethylene/butylene-styrene (SEBS). These are analyzed for the 7 application segments considered in the analysis.